No.6360-50 T:100um PO:90um Adhesive:10um Easy pick-up
日本狮力昂（Slion）UV晶片切割系列胶带：
#6360-00，#6360-20，#6360-80，#6360-15，#6360-50,#6360-25
产品特点：以具有強等方性伸特性的聚烯烴作為底基，切割時可堅固地固定物體
用途：UV照射後容易抽出晶片塗布UV剝離性膠粘劑的切割用膠帶，能使用於硅晶等，各種晶片的切割
NO.6360-50 Dicing tape (for Wafer)
Product Introduction
Dicing tapes (for wafer) consist of higher isotropic olefin backing and UV peeling adhesive.
Applications and Features
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